32nm Loongson 3B tapeout success

According to foreign media reports, Chinese researchers will introduce the new 3D processor manufactured by 32nm new technology at ISSCC 2013, the new international solid-state circuit conference in February next year. The official news from Loongson Zhongke stated that the new " The Loongson 3B 1500′′ processor has been successfully taped out in early October, but the specifications are slightly different from what the foreign media claim.

The Loongson 3B 1500 is currently being tested at the R&D center for functional and performance tests. Although the performance is still in the process of further optimization, the preliminary test results show that the performance of the Loongson 3B 1500 has been greatly improved compared to the Loongson 3A for the core applications and various test sets. The success of the tapeout also marks the completion of the technical indicators of the nuclear high base support mission.

The Loongson 3B 1500 is manufactured on 32nm process. The area of ​​the silicon wafer is 182.5mm2. It supports 1. 15-13.3V transformer, and it is dynamic frequency conversion. The measured core frequency is between 1.3GHz and 1.5GHz. The other HT bus frequency is 1600MHz and the DDR3 bus frequency is 600MHz. the above.

The processor integrates eight vector cores with a peak computing power of 192 GFlops and a power consumption of approximately 40-80W. Each core is configured with two private 256KB caches, all cores then share 8MB of on-chip L3 cache, and dual processors are also supported to form a 16-core CC-NUMA system directly through the HT bus.

The structure and package pins are basically compatible with the 65nm old Loongson 3B 1000, and the Godson 3B 1500 is also supported by the core, operating system, and upper layer applications used in the Loongson 3A/3B.

Loongson 3B 1500 processor in kind: on the left is the heat dissipation cover, right inside the socket is the processor real body

In addition, the "Godson 1D" in the Godson 1 series was also completed in June this year and entered the state of the tape. This is a high-precision, low-power measurement SoC tailored specifically for ultrasonic heat meters.

The Godson 1D's integrated time-to-digital converter is designed to measure resolutions up to 15ps and detect very small changes in flow. In terms of power management, Godson 1D contains 11 power domains, which can control the standby current below 10uA. The software and hardware co-design of the measurement process makes Godson 1D use a battery in the heat meter can work for more than five years.

In addition to the heat meter, Godson 1D can also be used in water meters, laser ranging, weight measurement and other occasions, is a very worthwhile product.