21ic News Great Alliance Holdings has announced that it has launched Toshiba's complete solution for smartphone applications, including Toshiba's higher performance CMOS image sensor, digital camera module, FRC Plus image processing technology, and short-range wireless transmission. Technology TransferJet, high efficiency and fast wireless charging solution, Near Field Communication (NFC) chipset, Bluetooth & Wi-Fi integrated single chip, ApP-Lite (Lite Application Processor) and interface bridge chip.
This article refers to the address: http://
Figure 1 - System diagram of Toshiba's system for smartphone applications
CMOS image sensor IC
A CMOS area array image sensor is an integrated circuit (IC) that converts light into an electrical signal. Such sensors contain an array of photodiodes with multiple CMOS transistors per pixel.
To meet the needs of market miniaturization and higher performance, Toshiba has developed CMOS area array sensors such as microlenses and photodiode optimization. Toshiba CMOS area array sensors have multiple resolutions from VGA to over 10 million pixels, and pixel pitches from 1.12μm to 5.6μm, suitable for smartphones, tablet computers, surveillance cameras, and car cameras.
application
Toshiba offers a wide range of CMOS area array image sensors for a wide range of applications, including tablet computers, cell phones and handheld products.
Figure 2 - Toshiba CMOS sensor application case of Grand Alliance
· Pixel spacing from 1.12 μm to 5.6 μm, VGA to over 10 million pixels
· High dynamic range (HDR) and color noise reduction (CNR)
· High sensitivity back side illumination (BSI) image sensor
· Modules, packages and dies are available.
Product lineup
Figure 3 - Toshiba T4K82 1/3.07" 13 million pixel 1.12um BSI CMOS sensor
Short-range wireless transmission technology TransferJetTM compliant IC
Figure 4 - Toshiba's TransferJetTM IC for smartphone applications
Figure 5 - Toshiba's TransferJetTM IC product line for smartphone applications
Wireless charging power IC
Figure 6 - Introduction to the wireless charging power IC for Toshiba related to smartphone applications
Figure 7 - Toshiba's wireless charging power IC product line for smartphone applications
Near Field Communication (NFC) chipset
Figure 8 - Introduction to the NFC module of the Toshiba related to smartphone applications
Bluetooth Series Integrated Single Chip
Figure 9 - Toshiba's BluetoothTM series integrated single-chip product line for smartphone applications
At present, Toshiba's Bluetooth IC product portfolio includes Bluetooth chip TC35661 and low-power Bluetooth chip TC35667 and low-power Bluetooth and NFC function chip TC35670.
application
· Audio equipment
· Mobile device
· Wearable device
· Health care device
· Action around
· remote control
Main specifications
Bluetooth Product Lineup
Interface bridge chip
As the resolution and image quality of multimedia content become higher and higher, it is inevitable to receive or transmit a large amount of data at high speed on peripheral devices such as video cameras and liquid crystal displays, because only the main processing such as baseband and application processor can be satisfied. The job requirements of the device. Toshiba has introduced an interface bridge chip called "Mobile Peripheral Device (MPD)" that supports high-speed data transfer protocols such as MIPI, LVDS, Display Port and HDMI. Toshiba's MPD not only transmits data at high speed, but also bridges the main processor and peripherals of different interfaces. Toshiba also introduced a broad portfolio of peripherals, such as input and output expansion devices and SC card controllers.
Figure 10 - Toshiba's interface bridge chip for smartphone applications
Toshiba's bridge and buffer ICs support a variety of serial data transfer protocols such as MIPI®, MDDI, LVDS, Display Port and HDMI for easy cell phone design.
Input/output expander ICs easily enhance the input/output capabilities of existing systems, including GPIOs, keyboards, LED controllers, and timers. The expander has a wide range of applications, including mobile phones, digital cameras, printers and the like.
In addition, Toshiba is also developing various peripheral processor peripheral products, such as SD card host controllers that can transfer data to SD cards at high speed.
Figure 11 - Toshiba's I/O interface combination for interface bridge chips for smartphone applications
All air springs are sourced globally from manufacturers to the original equipment market with IS9001 and TS16949 and certificates of conformity. All air spring mounting studs and air inlets are covered by protective caps. Where applicable, air springs are supplied complete with the relevant fitting kits.
Air springs are produced by a superior manufacturing process which is a reliable steam production method which gives extended service life, durability and constant quality to the rubber diaphragms.
Diaphragm And Airbag,Pneumatic Diaphragm Valve,Diaphragm Control Valve,Diaphragm Solenoid Valve
Shenyang Zhicheng Heavy Machinery Manufacturing Co., Ltd. , https://www.zhichengmachinery.com