Tan Changlin, general manager of TSMC Solid State Lighting, pointed out that TSMC's solid-state lighting will continue to expand this year, mainly because the LED lighting industry will continue to increase.
For the current revenue share of TSMC, the 矽 substrate accounts for about 50%, and the non-矽 substrate accounts for another 50%. Tan Changlin pointed out that although the ruthenium substrate has the advantage of lower cost than the sapphire substrate, the ruthenium substrate is likely to cause cracking of the epitaxial layer due to the difference in thermal expansion coefficient between the GaN epitaxial film and the ruthenium substrate. The yield is easily affected. However, the LED yield of the TSMC solid-state lighting substrate has been raised to a good level, and the company has the strong capacity and technical backing of TSMC. These are the advantages of TSMC.
Tan Changlin further stressed that TSMC solid-state lighting is quite optimistic about the growth of the Southeast Asian market, and the company will also seek opportunities to indirectly cut into the Southeast Asian market by shipping LED chips to the lighting factory. He believes that the current nuclear power plant disputes are getting worse and stronger, and Taiwan's electricity price is too low, there is room for increase in the future, so the demand for LED lighting will continue to grow in the future, he believes that the LED lighting market will be quite in the next few years. Exciting.
Zhang Zhongmou, chairman of TSMC, said at the law conference that the LED industry has recently been more friendly, and TSMC solid-state lighting has also contributed revenue in Q4 last year. He is optimistic that this part of the growth this year will be " Very significant" (dramatically).
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High Voltage SWA Armored Cable, also known as Steel Wire Armored Cable, is a type of Power Cable used for transmitting electrical power at high voltage levels. It is designed to withstand high voltage levels and provide protection against mechanical damage, moisture, and other external factors.
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