MEMS mainly includes micro-mechanisms, micro-sensors, micro-actuators and corresponding processing circuits. It is a high-tech cutting-edge discipline developed on the basis of incorporating a variety of micro-machining technologies and applying the latest achievements of modern information technology.
The development of MEMS technology has opened up a new field of technology and industry, using micro-sensors, micro-actuators, micro-components, micro-mechanical optics, vacuum micro-electronic devices, power electronics, etc. fabricated by MEMS technology in aviation, aerospace, automotive, Biomedical, environmental monitoring, military, and almost all areas of contact with people have broad application prospects. MEMS technology is developing into a huge industry. Just like the huge changes brought about by the microelectronics industry and the computer industry in the past 20 years, MEMS is also cultivating a profound technological change and a new round of impact on human society. . At present, the leading products in the MEMS market are pressure sensors, accelerometers, micro gyroscopes, ink nozzles and hard disk drive heads. Most industrial observers predict that sales of MEMS devices will increase rapidly in the next five years, with an average annual growth rate of about 18%, thus providing developments in mechanical and electronic engineering, precision machinery and instrumentation, and semiconductor physics. Excellent opportunities and severe challenges.
MEMS pressure sensors can be fabricated in high-precision, low-cost, high-volume production using integrated circuit-like design techniques and manufacturing processes, opening the door to cost-effective use of MEMS sensors for consumer electronics and industrial process control products at a low cost. Control is simple, easy to use, and intelligent. Compared to traditional mechanical sensors, MEMS pressure sensors are smaller in size, up to a maximum of one centimeter, and have a significant price/performance ratio over traditional "mechanical" manufacturing techniques.
Figure 1 Wheatstone bridge electrical principle
Figure 2 Lithographic version of the strain gage bridge
Figure 3 Silicon piezoresistive pressure sensor structure
Panos Datskos and Nickolay Lavrik of Oak Ridge National Laboratory in the United States used MEMS sensors to detect 5.5 fs of material, setting a new world record. It uses only 2 tun long, 50 am thick silicon cantilevers that are vibrated by an inexpensive diode laser.
Datskos plans to increase the sensitivity of MEMS sensors by increasing the resonant frequency from the current 2 MHz to 50 MHz and correspondingly making the cantilever smaller and harder, ultimately achieving the goal of detecting individual molecules.
Freescale Semiconductor introduces three high-sensitivity sensors using MMA6270Q (XY-axis), MMA6280Q (one-axis) and MMA7261Q (XYZ-axis) sensors made of MEMS to lock low-cost consumer electronics The market's low-gravity (1 ow-g) sensors detect drops, tilts, movements, positioning and vibrations that can be caused by small changes in force.
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