[Source: Gaogong LED's "LED Good Products" magazine April issue (P50) Reporter / He Wei] High-brightness LED is widely used in LCD TV backlights, automotive headlamps, lighting equipment, etc. It is expected to appear in the future. The expansion of the medium and long-term market. For the sapphire used in high-brightness LEDs, the previous mainstream processing method is to use a tool for cutting.
However, with the expansion of the market, higher requirements have been placed on improving productivity and yield of finished products. In addition to the rapid spread of laser processing, laser processing has become a mainstream process in sapphire processing for high-brightness LEDs.
Laser processing increases production efficiency
"In the development of LED wafer dicing technology, laser cutting has been developed to laser cutting. Laser cutting has advantages over traditional diamond dicing technology in terms of product yield and operating cost." Shenzhen Dazu Tang Jiangang, head of the Precision Laser Micromachining Center of Laser Technology Co., Ltd. (hereinafter referred to as "Dazhu Laser") said.
In the Taiwan chip line generally requires more than 30um depth requirements, LED wafer manufacturing technology is developing rapidly. In order to improve luminous efficiency and brightness, wafer structure changes often make dicing equipment face great challenges. Traditional diamond tools Cutting has not been able to meet market needs.
It is understood that the diamond dicing machine relies on the skill level of the operator in the operation process, so the qualified rate of the finished product is unstable, and the quality of the processed product is uneven. In addition, the operator must pay attention to the device at all times, which is costly, and the diamond tool as a consumable is expensive, extremely wearable, and has a high replacement frequency, resulting in high production cost.
With laser cutting, the cutting speed can reach 100mm/s or more under the condition of maintaining the same brightness, which is several times of cutting the tool, which can greatly improve the production efficiency and guarantee the mass production.
Fully automatic machine, just input the cutting parameters and install the wafer cassette on the device, it can be fully automatic operation, completely independent of the skill level of the operator. At the same time, the laser belongs to non-contact processing, which does not require consumables and coolant during cutting. It also reduces the workpiece replacement time necessary for the diamond dicing machine, reduces the operator's working time and workload, and further reduces production costs.
At present, laser processing is mainly divided into ablation cutting and stealth cutting. The principle of ablation cutting is a cutting method that focuses the laser on the surface of the workpiece and instantly vaporizes the surface of the workpiece.
Since 2009, Han's Laser has successfully launched a variety of LED UV laser dicing machine products for ablation cutting, and quickly entered the field of LED wafer dicing.
In order to ensure the long-term stability of product quality, the UV laser scriber is designed with a precision three-dimensional workbench, fully automatic loading and unloading, and autofocus. Automatic template recognition, angle correction, automatic contour finding, contour correction, automatic glue application and cleaning functions through software. In a short period of time, the industry has been recognized and the market has received enthusiastic response.
Join hands with Japan Hamamatsu to push the stealth dicing machine
The development of technology is endless. The pursuit of higher luminous efficiency of LED chips is unchanged in the industry, and the evolution of upstream chip technology will inevitably lead to technological changes in related equipment.
In order to meet the market's pursuit of higher brightness chips, invisible cutting processing, which is basically a process that does not affect the brightness of the chip, is undoubtedly the best choice. In the past, stealth cutting technology has been controlled by Japanese companies. The sapphire laser cutting technology of the LED wafer developed by Hamamatsu Photonics Society of Japan, StealthDicing, is the most advanced technology in the field of LED dicing. Obtained the only invention patent in the world.
Unfinished: For more information, please refer to the April issue of Gaogong LED's "LED Good Products" magazine.
However, with the expansion of the market, higher requirements have been placed on improving productivity and yield of finished products. In addition to the rapid spread of laser processing, laser processing has become a mainstream process in sapphire processing for high-brightness LEDs.
Laser processing increases production efficiency
"In the development of LED wafer dicing technology, laser cutting has been developed to laser cutting. Laser cutting has advantages over traditional diamond dicing technology in terms of product yield and operating cost." Shenzhen Dazu Tang Jiangang, head of the Precision Laser Micromachining Center of Laser Technology Co., Ltd. (hereinafter referred to as "Dazhu Laser") said.
In the Taiwan chip line generally requires more than 30um depth requirements, LED wafer manufacturing technology is developing rapidly. In order to improve luminous efficiency and brightness, wafer structure changes often make dicing equipment face great challenges. Traditional diamond tools Cutting has not been able to meet market needs.
It is understood that the diamond dicing machine relies on the skill level of the operator in the operation process, so the qualified rate of the finished product is unstable, and the quality of the processed product is uneven. In addition, the operator must pay attention to the device at all times, which is costly, and the diamond tool as a consumable is expensive, extremely wearable, and has a high replacement frequency, resulting in high production cost.
With laser cutting, the cutting speed can reach 100mm/s or more under the condition of maintaining the same brightness, which is several times of cutting the tool, which can greatly improve the production efficiency and guarantee the mass production.
Fully automatic machine, just input the cutting parameters and install the wafer cassette on the device, it can be fully automatic operation, completely independent of the skill level of the operator. At the same time, the laser belongs to non-contact processing, which does not require consumables and coolant during cutting. It also reduces the workpiece replacement time necessary for the diamond dicing machine, reduces the operator's working time and workload, and further reduces production costs.
At present, laser processing is mainly divided into ablation cutting and stealth cutting. The principle of ablation cutting is a cutting method that focuses the laser on the surface of the workpiece and instantly vaporizes the surface of the workpiece.
Since 2009, Han's Laser has successfully launched a variety of LED UV laser dicing machine products for ablation cutting, and quickly entered the field of LED wafer dicing.
In order to ensure the long-term stability of product quality, the UV laser scriber is designed with a precision three-dimensional workbench, fully automatic loading and unloading, and autofocus. Automatic template recognition, angle correction, automatic contour finding, contour correction, automatic glue application and cleaning functions through software. In a short period of time, the industry has been recognized and the market has received enthusiastic response.
Join hands with Japan Hamamatsu to push the stealth dicing machine
The development of technology is endless. The pursuit of higher luminous efficiency of LED chips is unchanged in the industry, and the evolution of upstream chip technology will inevitably lead to technological changes in related equipment.
In order to meet the market's pursuit of higher brightness chips, invisible cutting processing, which is basically a process that does not affect the brightness of the chip, is undoubtedly the best choice. In the past, stealth cutting technology has been controlled by Japanese companies. The sapphire laser cutting technology of the LED wafer developed by Hamamatsu Photonics Society of Japan, StealthDicing, is the most advanced technology in the field of LED dicing. Obtained the only invention patent in the world.
Unfinished: For more information, please refer to the April issue of Gaogong LED's "LED Good Products" magazine.
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